JPH03298Y2 - - Google Patents
Info
- Publication number
- JPH03298Y2 JPH03298Y2 JP15097386U JP15097386U JPH03298Y2 JP H03298 Y2 JPH03298 Y2 JP H03298Y2 JP 15097386 U JP15097386 U JP 15097386U JP 15097386 U JP15097386 U JP 15097386U JP H03298 Y2 JPH03298 Y2 JP H03298Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal frame
- circuit board
- printed circuit
- soldering
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 37
- 229910000679 solder Inorganic materials 0.000 claims description 24
- 238000005476 soldering Methods 0.000 claims description 22
- 230000004907 flux Effects 0.000 description 9
- 239000007788 liquid Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15097386U JPH03298Y2 (en]) | 1986-09-30 | 1986-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15097386U JPH03298Y2 (en]) | 1986-09-30 | 1986-09-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6356966U JPS6356966U (en]) | 1988-04-16 |
| JPH03298Y2 true JPH03298Y2 (en]) | 1991-01-08 |
Family
ID=31067603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15097386U Expired JPH03298Y2 (en]) | 1986-09-30 | 1986-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03298Y2 (en]) |
-
1986
- 1986-09-30 JP JP15097386U patent/JPH03298Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6356966U (en]) | 1988-04-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH03298Y2 (en]) | ||
| JPH0927678A (ja) | プリント配線板の部品実装方法 | |
| JP2010080945A (ja) | 挿入実装部品の半田付け方法、挿入実装部品の半田付け構造及び電子回路基板 | |
| JP3067326B2 (ja) | 半田付け方法 | |
| US5737043A (en) | Liquid crystal display panel holding metal fixture | |
| JPH0846348A (ja) | 混載基板の部品実装方法 | |
| JPH0487393A (ja) | 表面実装用プリント板 | |
| JPH07147495A (ja) | プリント基板表面実装用シールドケース | |
| JP2553104Y2 (ja) | プリント基板の反り防止用治具 | |
| JP3208993B2 (ja) | 高周波機器のフレームおよび高周波機器の製造方法 | |
| JPH0337466B2 (en]) | ||
| JPH02305499A (ja) | シールドケース | |
| JP4720033B2 (ja) | スルーホール電極のはんだコーティング用マスクおよびはんだコーティング方法 | |
| JPH0710554Y2 (ja) | 高周波機器のシールドケース | |
| JPH04269894A (ja) | プリント回路基板への面実装部品の半田付け方法 | |
| JPH0737321Y2 (ja) | 表面実装用半導体装置 | |
| JPH0242794A (ja) | 部品のハンダ付方法 | |
| JPH04206597A (ja) | プリント配線基板 | |
| JPS6114791A (ja) | 電子部品装着用プリント基板 | |
| JPH02237099A (ja) | シールド装置 | |
| JPH02156514A (ja) | 表面実装用チップ部品 | |
| JP2001007571A (ja) | プリント基板 | |
| JPH04237155A (ja) | 電子部品 | |
| JPH0559897U (ja) | シールドケース | |
| JPS637697A (ja) | シヤ−シベ−スとプリント基板の接続方法 |